Surface Protection

 

Types
ENIG - nickel / gold - Aurotech
HAL Sn/Pb
HAL Leadfree (SN100C)
Immersion tin - Stannatech
Immersion silver - AlphaSTAR
Hard gold (connectors etc.)
Soft gold (gold wire bonding)
Layer thickness
Ni 3 - 6 um, Au 0,05 - 0,15 um
2 - 20 um
2 - 20 um
0,9 - 1,2 um
0,15 - 0,3 um
min. 0,8 um
0,7-1,0 um

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