Softgold

PCBs for gold wire bonding

Soft gold plating for gold wire bonding application. Soft electrolytic gold is a pure gold layer plated on top of a nickel deposit.
The soft gold layer is normally plated selectively onto all exposed pads of a circuit (excluding edge connectors, which require hard gold). Selective electroplating requires a combination of masking and bussing (providing current to the pads of the circuit being electroplated). The soft gold layer has a thickness of 0.7-1.0 µm and can be easily soldered and wire bonded.

 

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